Sk Hynix Showcases Samples Of Earth'Second Starting Time 321-Layer Nand
SK hynix Inc. (or "the company", https://www.skhynix.com/) showcased today the sample of the 321-layer 4D NAND, making populace the progress on its evolution of the manufacture's get-go NAND with more than 300 layers.
The society gave a presentation on the progress on the evolution of its 321-layer 1Tb TLC 4D NAND Flash as well as displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. eight-ten inwards Santa Clara.
SK hynix is the kickoff in the industry to unveil the progress on the evolution of a NAND amongst more than 300 layers inward particular. The companionship plans to enhance the grade of completion of the 321-layer production as well as starting time bulk production from the beginning one-half of 2025.
The fellowship said its technological competitiveness accumulated from the success of the globe'sec highest 238-layer NAND, already in mass production, paved the mode for a smooth progress for the development of the 321-layer product. "With some other breakthrough to address stacking limitations, SK hynix volition open up the era of NAND with more than 300 layers in addition to Pb the market place."
The 321-layer 1Tb TLC NAND comes alongside a 59% improvement inwards productivity, compared alongside the earlier generation of 238-layer 512Gb, cheers to the engineering science development that enabled stacking of more cells as well as larger storage capacity on a single fleck, pregnant the total capacity that can be produced on a single wafer increased.
Since the introduction of ChatGPT that accelerated the increase of the generative AI marketplace, demand for high-functioning as well as high-capacity retention products that tin procedure more information at a faster stride is growing quickly.
Accordingly, at the FMS, SK hynix also introduced next-generation NAND solutions optimized for such AI postulate, including the company SSD adopting the PCIe Gen5 interface and UFS four.0.
The fellowship expects these products to attain industry-leading operation to fully come across the needs of the customers with a focus on high performance.
SK hynix besides announced that it has started evolution of the next-generation PCIe Gen6 together with UFS 5.0 amongst the improved applied science for solution development that it acquired through these products too expressed its commitment to leading the manufacture trend.
SOURCE SK hynix Inc.
The society gave a presentation on the progress on the evolution of its 321-layer 1Tb TLC 4D NAND Flash as well as displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. eight-ten inwards Santa Clara.
SK hynix is the kickoff in the industry to unveil the progress on the evolution of a NAND amongst more than 300 layers inward particular. The companionship plans to enhance the grade of completion of the 321-layer production as well as starting time bulk production from the beginning one-half of 2025.
The fellowship said its technological competitiveness accumulated from the success of the globe'sec highest 238-layer NAND, already in mass production, paved the mode for a smooth progress for the development of the 321-layer product. "With some other breakthrough to address stacking limitations, SK hynix volition open up the era of NAND with more than 300 layers in addition to Pb the market place."
The 321-layer 1Tb TLC NAND comes alongside a 59% improvement inwards productivity, compared alongside the earlier generation of 238-layer 512Gb, cheers to the engineering science development that enabled stacking of more cells as well as larger storage capacity on a single fleck, pregnant the total capacity that can be produced on a single wafer increased.
Since the introduction of ChatGPT that accelerated the increase of the generative AI marketplace, demand for high-functioning as well as high-capacity retention products that tin procedure more information at a faster stride is growing quickly.
Accordingly, at the FMS, SK hynix also introduced next-generation NAND solutions optimized for such AI postulate, including the company SSD adopting the PCIe Gen5 interface and UFS four.0.
The fellowship expects these products to attain industry-leading operation to fully come across the needs of the customers with a focus on high performance.
SK hynix besides announced that it has started evolution of the next-generation PCIe Gen6 together with UFS 5.0 amongst the improved applied science for solution development that it acquired through these products too expressed its commitment to leading the manufacture trend.
Jungdal Choi, Head of NAND Development, said during a keynote spoken language that the company expects the ongoing evolution of the 321-layer production, the fifth generation of the 4D NAND, to help the company solidify its technological leadership inwards the NAND infinite. "With timely introduction of the high-operation and high-capacity NAND, we will strive to see the requirements of the AI era as well as go along to Pb conception."
SOURCE SK hynix Inc.
